Customizable SFF Motherboard PCBA High Density 6-Layer PCB board with RoHS Compliant for Automotive & Consumer Electronics
1.Product Features and Advantages
(1) Compact Design & Space Efficiency
Ultra-small form factor (e.g., Mini-ITX, Nano-ITX, or custom sizes <100mm×100mm) for embedded systems, IoT devices, and portable electronics.
High-density component integration (surface-mount technology, BGA, 01005 passive components) to minimize PCB area.
(2) Low Power Consumption
Optimized for energy-efficient processors (e.g., Intel Atom, ARM-based CPUs) with TDP ≤15W.
Power management ICs (PMICs) for dynamic voltage/frequency scaling and sleep modes (e.g., <1W standby power).
(3) Flexible Connectivity & Expansion
Support for miniaturized interfaces: M.2, PCIe Mini Card, USB-C, LVDS, eDP, and low-profile headers.
Customizable I/O configurations (e.g., GPIO, serial ports, Ethernet) for industrial or consumer applications.
(4) High Reliability & Durability
Industrial-grade components (operating temp: -40°C to +85°C) with extended lifecycle support.
Robust thermal design (metal-core PCBs, heat spreaders) for continuous 24/7 operation.
(5) Cost-Effectiveness
Reduced material costs via smaller PCB size and simplified assembly (fewer layers, standard FR-4 materials).
Mass-production scalability with SMT automation and standardized testing processes.
2. Technical Challenges of small-form-factor (SFF) computer motherboard PCBA
(1) Thermal Management in Compact Spaces
Heat concentration from high-power components (CPUs, GPUs) requiring micro-vias, vapor chambers, or active cooling solutions.
Risk of thermal throttling if junction temperatures exceed 100°C (e.g., need for thermal simulation during design).
(2) Signal Integrity & EMI/EMC Compliance
High-speed traces (PCIe 4.0, USB 4.0) requiring precise impedance control (50Ω/90Ω) and layer shielding.
Compliance with FCC Part 15, CE EMC, and industrial standards (e.g., EN 61000) for noise reduction.
(3) High-Density Component Placement
Minimum line/space ≤5mil (0.127mm) for fine-pitch BGA (e.g., 0.4mm pitch) and micro-vias for interlayer connectivity.
Risk of solder bridging or open circuits during assembly, requiring AOI/X-ray inspection.
(4)Power Distribution Network (PDN) Design
Low-voltage, high-current rails (e.g., 1.0V@50A for CPUs) needing thick copper planes (2oz+) and decoupling capacitors.
PDN impedance control to prevent voltage droop and switching noise.
(5) Miniaturized Cooling Solutions
Limited space for heatsinks/fans, requiring passive cooling designs (heat pipes, thermal pads) or innovative layouts.
Balance between cooling efficiency and acoustic noise (critical for medical/consumer devices).
(6)Long-Term Component Availability
Risk of EOL (end-of-life) components in embedded systems, necessitating design for obsolescence management (DfOM).
Ring PCB has successfully addressed the above-mentioned technical challenges and problems. We accept quick prototyping within 3 to 7 days, customize various types of PCBA, and enable mass production to meet your different order requirements.
3.SFF Computer Motherboard PCBA Rigid Board Technical Parameters
| Parameter | Description & Typical Range/Values |
| Number of Layers | 4-16 layers (common: 4, 6, 8 layers for compact designs; 10-16 layers for high-density/high-speed applications) |
| PCB Material | - FR-4 (standard, e.g., IPC-4101 Class 2/3)- High-temperature FR-4 (e.g., TG ≥170°C for industrial use)- High-frequency materials (e.g., Rogers, Isola) for RF applications |
| Board Thickness | - 0.8 mm to 2.0 mm (common: 1.0 mm, 1.6 mm)- Customizable (e.g., 0.6 mm for ultra-thin designs, 2.4 mm for rugged thermal support) |
| Surface Finish | - HASL (Hot Air Solder Leveling)- ENIG (Electroless Nickel Immersion Gold)- Immersion Silver (ImAg)- OSP (Organic Solderability Preservative)- ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) |
| Copper Thickness | - Inner layers: 18-70 μm (0.5-2 oz)- Outer layers: 35-105 μm (1-3 oz) (higher for power traces) |
| Minimum Line Width/Spacing | 50-100 μm (0.5-1 mil) for standard designs; down to 30 μm (0.3 mil) for high-density PCBs |
| Minimum Via Diameter | 0.3-0.6 mm (12-24 mil) for through-hole vias; 0.1-0.3 mm (4-12 mil) for microvias (in HDI boards) |
| Impedance Control | - Characteristic impedance: 50Ω, 75Ω (for signal lines)- Differential impedance: 100Ω, 120Ω (for USB, LVDS, etc.)- Tolerance: ±5% to ±10% |
| Board Dimensions | - Standard SFF form factors: Mini-ITX (170×170 mm), Nano-ITX (120×120 mm), Pico-ITX (100×72 mm), etc.- Custom dimensions (e.g., 100×100 mm, 200×150 mm) |
| Hole Plating Thickness | 25-50 μm (1-2 mil) for through-hole vias (IPC-6012 Class 2/3 compliant) |
| Thermal Management | - Metal core (aluminum, copper) for heat dissipation- Thermal vias (filled with copper or conductive epoxy)- Heat sink mounting points |
| Assembly Technology | - SMT (Surface Mount Technology): 01005, 0201, 0402 components down to 0.3 mm pitch ICs- THT (Through-Hole Technology): optional for power connectors, relays, etc.- Mixed technology (SMT + THT) |
| Component Density | High-density assembly with BGA (Ball Grid Array), LGA (Land Grid Array), and fine-pitch components |
| RoHS/REACH Compliance | Compliant with EU RoHS 2.0 (Restriction of Hazardous Substances) and REACH regulations |
| Electromagnetic Compatibility (EMC) | - EMI shielding (ground planes, metal enclosures)- EMC compliance (e.g., EN 55032, FCC Part 15 Class B) |
| Operating Temperature Range | - Commercial grade: 0°C to +70°C- Industrial grade: -40°C to +85°C- Extended grade: -55°C to +125°C (with specialized components) |
| Conformal Coating | Optional (e.g., acrylic, polyurethane, silicone) for moisture, dust, and chemical resistance (common in industrial applications) |
Notes:
1. Parameters can be customized based on application requirements (e.g., medical, automotive, or consumer electronics).
4.Application Fields of Small-form-factor Computer Motherboard PCBA
1. Industrial Automation
Industrial control systems, HMI panels, embedded controllers, and ruggedized computing devices for factory automation.
2. Medical Equipment
Medical diagnostic devices, patient monitoring systems, portable healthcare devices, and low-power medical computers.
3. Embedded Systems
IoT gateways, edge computing nodes, smart home hubs, and embedded controllers for specialized applications.
4. Consumer Electronics
- Mini PCs, home theater systems (HTPCs), thin-client devices, and compact gaming consoles.
5. Automotive & Transportation
- In-vehicle infotainment systems (IVI), car computers, telematics units, and automotive embedded controllers.
6. Communication & Networking
- Network routers, switches, telecom equipment, and edge networking devices requiring compact form factors.
7. Aerospace & Defense (Specialized)
- Compact avionics systems, ruggedized military computers, and low-power embedded solutions (with extended temperature ratings).
8. Retail & Hospitality
- POS terminals, self-service kiosks, digital signage controllers, and interactive retail displays.
9. Education & Research
- Compact educational computers, lab instrumentation controllers, and low-cost development platforms.
At Ring PCB, we don’t just manufacture products—we deliver innovation. With all kinds of PCB Boards, combined with our PCB, PCB Assembly, and turn-key services, we empower your projects to thrive. Whether you need prototyping or mass production, our expert team ensures top-quality results and help you to save money and time.
17 Years of Excellence | Self-Owned Factory | End-to-End Technical Support
Core Advantage 1: Advanced Engineering for Precision PCB Manufacturing
• High-Density Stack-Up: 2-48 layer boards with blind/buried vias, 3/3mil trace/spacing, ±7% impedance control, ideal for 5G, industrial control, medical devices, and automotive electronics.
• Smart Manufacturing: Self-owned facility equipped with LDI laser exposure, vacuum lamination, and flying probe testers, adhering to IPC-6012 Class 3 standards.
Core Advantage 2: Integrated PCBA Services | One-Stop Turnkey Solutions
✓ Full Assembly Support: PCB fabrication + component sourcing + SMT assembly + functional testing.
✓ DFM/DFA Optimization: Expert engineering team reduces design risks and BOM costs.
✓ Rigorous Quality Control: X-ray inspection, AOI testing, and 100% functional validation for zero-defect delivery.
Core Advantage 3: Self-Owned Factory with Full Supply Chain Control
✓ Vertical Integration: Raw material procurement, production, and testing fully managed in-house.
✓ Triple Quality Assurance : AOI + impedance testing + thermal cycling, defect rate <0.2% (industry average: <1%).
✓ Global Certifications: ISO9001, IATF16949 and RoHS compliance.
Ring PCB not only offers professional PCB manufacturing, but also offer PCBA service, including component sourcing and SMT service with Samsung functional machine.
One of our core strengths lies in our 8-stage lead-free reflow soldering and lead-free wave soldering capabilities at our Shenzhen factory. These advanced soldering processes ensure high-quality assembly while adhering to global environmental standards, such as ISO9001, IATF16949 ,RoHS compliance.
Please note:
All products in our store are processing customized services, please be sure to contact our professional customer service before placing an order to confirm the product specification in details.
All photos on this site are real. Due to changes in lighting, shooting Angle, and display resolution, the image you see may have some degree of chromatic aberration. Thank you for your understanding.
Ring PCB Technology Co.,Limited is a professional PCB manufacturer with 17 years of history in China.
Our products are updated and upgraded every year and we specialize in all kinds of PCB making and PCBA customization services, If you are interested in our products, please tell us your requirements, we will help you to provide professional solutions, please contact us on line or E-mail to us info@ringpcb.com, and we will provide you with one-on-one service from our professional sales team.
Thank you for your time.
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Customizable SFF Motherboard PCBA High Density Fast Turn Assembly For Automotive & Consumer Electronics Images
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